Ruthenium layer formation for copper film deposition

ABSTRACT

In one embodiment, a method for forming a material on a substrate is provided which includes positioning a substrate containing a dielectric material having vias formed therein within a process chamber, forming a barrier layer within the vias and on the dielectric material during a barrier deposition process, forming a ruthenium layer on the barrier layer during a ruthenium deposition process, and filling the vias with a copper material during a copper deposition process. The copper material may be formed by depositing a copper bulk layer over a copper seed layer. The method further provides that the ruthenium layer may be formed by an atomic layer deposition process (ALD) or a physical vapor deposition (PVD) process and the copper material may be formed by an electroless chemical plating process, an electroplating process, a chemical vapor deposition process, an ALD process and/or a PVD process.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application is a continuation of U.S. Ser. No. 10/634,662(APPM/005975.P1), filed Aug. 4, 2003, which is a continuation-in-part ofU.S. Ser. No. 10/443,648 (APPM/005975), filed May 22, 2003, which claimsbenefit of U.S. Ser. No. 60/385,499 (APPM/005975L), filed Jun. 4, 2002,which are herein incorporated by reference in their entirety.

BACKGROUND OF THE INVENTION

1. Field of the Invention

Embodiments of the invention generally relate to a method for formingnoble metal layers, and more particularly to methods for formingruthenium layers used in copper integration.

2. Description of the Related Art

Sub-quarter micron, multi-level metallization is one of the keytechnologies for the next generation of very large scale integration(VLSI) and ultra large scale integration (ULSI) semiconductor devices.The multilevel interconnects that lie at the heart of this technologyrequire the filling of contacts, vias, lines, and other features formedin high aspect ratio apertures. Reliable formation of these features isvery important to the success of both VLSI and ULSI as well as to thecontinued effort to increase client density and quality on individualsubstrates and die.

As circuit densities increase, the widths of contacts, vias, lines andother features, as well as the dielectric materials between them maydecrease to less than about 250 nm, whereas the thickness of thedielectric layers remains substantially constant with the result thatthe aspect ratios for the features, i.e., their height divided by width,increases. Many conventional deposition processes have difficultyfilling structures where the aspect ratio exceeds 6:1, and particularlywhere the aspect ratio exceeds 10:1. As such, there is a great amount ofongoing effort being directed at the formation of void-free,nanometer-sized structures having aspect ratios wherein the ratio offeature height to feature width can be 6:1 or higher.

Additionally, as the feature widths decrease, the device currenttypically remains constant or increases, which results in an increasedcurrent density for such feature. Elemental aluminum and aluminum alloyshave been the traditional metals used to form vias and lines insemiconductor devices because aluminum has a perceived low electricalresistivity, superior adhesion to most dielectric materials, ease ofpatterning, and the ability to obtain aluminum in a highly pure form.However, aluminum has a higher electrical resistivity than other moreconductive metals such as copper. Aluminum can also suffer fromelectromigration leading to the formation of voids in the conductor.

Copper and copper alloys have lower resistivities than aluminum, as wellas a significantly higher electromigration resistance compared toaluminum. These characteristics are important for supporting the highercurrent densities experienced at high levels of integration andincreased device speed. Copper also has good thermal conductivity.Therefore, copper is becoming a choice metal for filling sub-quartermicron, high aspect ratio interconnect features on semiconductorsubstrates.

A thin film of a noble metal such as, for example, palladium, platinum,cobalt, nickel and rhodium, among others may be used as an underlayerfor the copper vias and lines. Such noble metals, which are resistant tocorrosion and oxidation, may provide a smooth surface upon which acopper seed layer is subsequently deposited using for example, anelectrochemical plating (ECP) process.

The noble metal is typically deposited using a chemical vapor deposition(CVD) process or a physical vapor deposition (PVD) process.Unfortunately, noble metals deposited on high aspect ratio interconnectfeatures using CVD and/or PVD processes generally have poor stepcoverage (e.g., deposition of a non-continuous material layer). The poorstep coverage for the noble metal material layer may cause thesubsequent copper seed layer deposition using an ECP process to benon-uniform.

Therefore, a need exists for a method to deposit a noble metal, such asruthenium, within a high aspect ratio interconnect feature whilemaintaining good step coverage.

SUMMARY OF THE INVENTION

A method of noble metal layer formation for high aspect ratiointerconnect features is described herein. The noble metal layer isformed using a cyclical deposition process, such as atomic layerdeposition (ALD). The cyclical deposition process includes alternatelyadsorbing a noble metal-containing precursor and a reducing gas on asubstrate structure. The adsorbed noble metal-containing precursorreacts with the reducing gas to form the noble metal layer on thesubstrate. Suitable noble metals may include, for example, ruthenium,palladium, platinum, cobalt, nickel, or rhodium.

The noble metal layer formation is compatible with integrated circuitfabrication processes. In one integrated circuit fabrication process,the noble metal layer may be used as an underlayer for a copper seedlayer within a copper interconnect. For such an embodiment, a preferredprocess sequence includes providing a substrate having an interconnectpattern defined in one or more dielectric layers formed thereon. Theinterconnect pattern includes a barrier layer conformably depositedthereon. A noble metal layer (e.g., ruthenium) is conformably depositedon the barrier layer. The noble metal layer is deposited using acyclical deposition process by alternately exposing the substrate to anoble metal-containing gas and a reducing gas. Thereafter, the copperinterconnects are completed by depositing a copper seed layer on thenoble metal layer and filling the vias with bulk copper metal.

In one embodiment, a method for forming a film on a substrate isprovided which includes positioning the substrate within a processchamber and forming a ruthenium layer on at least a portion of thesubstrate by sequentially chemisorbing monolayers of aruthenium-containing compound and a reducing gas on the substrate toform the ruthenium layer.

In another embodiment, a method for forming a ruthenium layer on asubstrate for use in integrated circuit fabrication is provided whichincludes positioning the substrate within a process chamber, wherein theprocess chamber is in fluid communication with a gas delivery system,delivering a ruthenium-containing compound from the gas delivery systemto the process chamber, chemisorbing a ruthenium-containing layer on thesubstrate, delivering a reducing gas from the gas delivery system to theprocess chamber and reacting the reducing gas with theruthenium-containing layer to form the ruthenium layer on the substrate.

In another embodiment, a method for forming a layer containing rutheniummaterial on a substrate surface is provided which includes exposing thesubstrate surface to a ruthenium-containing compound to form aruthenium-containing layer on the substrate surface, purging the chamberwith a purge gas, reacting a reducing gas with the ruthenium-containinglayer, and purging the chamber with the purge gas.

In another embodiment, a method for forming a ruthenium layer on asubstrate is provided which includes positioning the substrate within aprocess chamber and forming the ruthenium layer on at least a portion ofthe substrate by sequentially chemisorbing monolayers of aruthenium-containing compound and a reducing gas. The method furtherincludes that the process chamber contains a substrate support, achamber lid with a passageway at a central portion of the chamber lidand having a bottom surface extending from the passageway to aperipheral portion of the chamber lid. The bottom surface is shaped andsized to substantially cover the substrate. The process chamber furthercontains one or more valves coupled to the passageway, one or more gassources coupled to each valve and a reaction zone. The reaction zone isdefined between the chamber lid and the substrate and occupies a smallvolume.

BRIEF DESCRIPTION OF THE DRAWINGS

So that the manner in which the above recited features of the inventionare attained and can be understood in detail, a more particulardescription of the invention, briefly summarized above, may be had byreference to the embodiments thereof which are illustrated in theappended drawings. It is to be noted, however, that the appendeddrawings illustrate only typical embodiments of this invention and aretherefore not to be considered limiting of its scope, for the inventionmay admit to other equally effective embodiments.

FIG. 1 depicts a schematic cross-sectional view of a process chamberthat may be used to perform a cyclical deposition process describedherein;

FIG. 2 depicts a schematic cross-sectional view of another processchamber that may be used to perform a cyclical deposition processdescribed herein;

FIG. 3 illustrates a process sequence for noble metal layer formationusing cyclical deposition techniques according to one embodimentdescribed herein;

FIG. 4 illustrates a process sequence for noble metal layer formationusing cyclical deposition techniques according to an alternateembodiment described herein; and

FIGS. 5A-5C illustrate schematic cross-sectional views of an integratedcircuit fabrication sequence.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT

FIG. 1 depicts a schematic cross-sectional view of a process chamber 10that can be used to perform integrated circuit fabrication in accordancewith embodiments described herein. The process chamber 10 generallyhouses a substrate support pedestal 48, which is used to support asubstrate (not shown). The substrate support pedestal 48 is movable in avertical direction inside the process chamber 10 using a displacementmechanism 48A.

Depending on the specific process, the substrate can be heated to somedesired temperature prior to or during deposition. For example, thesubstrate support pedestal 48 may be heated using an embedded heatingelement 52A. The substrate support pedestal 48 may be resistively heatedby applying an electric current from an AC power supply 52 to theheating element 52A. The substrate (not shown) is, in turn, heated bythe pedestal 48. Alternatively, the substrate support pedestal 48 may beheated using radiant heaters such as, for example, lamps (not shown).

A temperature sensor 50A, such as a thermocouple, is also embedded inthe substrate support pedestal 48 to monitor the temperature of thepedestal 48 in a conventional manner. The measured temperature is usedin a feedback loop to control the AC power supply 52 for the heatingelement 52A, such that the substrate temperature can be maintained orcontrolled at a desired temperature which is suitable for the particularprocess application.

A vacuum pump 18 and the conduit system 46A are used to evacuate theprocess chamber 10 and to maintain the pressure inside the processchamber 10. A gas manifold 34, through which process gases areintroduced into the process chamber 10, is located above the substratesupport pedestal 48. The gas manifold 34 is connected to a gas panel(not shown), which controls and supplies various process gases to theprocess chamber 10.

Proper control and regulation of the gas flows to the gas manifold 34are performed by mass flow controllers (not shown) and a microprocessorcontroller 70. The gas manifold 34 allows process gases to be introducedand uniformly distributed in the process chamber 10. Additionally, thegas manifold 34 may optionally be heated to prevent condensation of anyreactive gases within the manifold.

The gas manifold 34 includes a plurality of electronic control valves(not shown). The electronic control valves as used herein refer to anycontrol valve capable of providing rapid and precise gas flow to theprocess chamber 10 with valve open and close cycles within a range fromabout 0.01 seconds to about 10 seconds, preferably, from about 0.05seconds to about 2 seconds, and more preferably, from about 0.1 secondsto about 1 second.

The microprocessor controller 70 may be one of any form of generalpurpose computer processor (CPU) that can be used in an industrialsetting for controlling various chambers and sub-processors. Thecomputer may use any suitable memory, such as random access memory, readonly memory, floppy disk drive, compact disc drive, hard disk, or anyother form of digital storage, local or remote. Various support circuitsmay be coupled to the CPU for supporting the processor in a conventionalmanner. Software routines as required, may be stored in the memory orexecuted by a second, remotely located CPU.

The software routines are executed to initiate process recipes orsequences. The software routines, when executed, transform the generalpurpose computer into a specific process computer that controls thechamber operation so that a chamber process is performed. For example,software routines may be used to precisely control the activation of theelectronic control valves for the execution of process sequencesaccording to the present invention. Alternatively, the software routinesmay be performed in hardware, as an application specific integratedcircuit or other type of hardware implementation, or a combination ofsoftware or hardware.

FIG. 2 is a schematic cross-sectional view of one embodiment of achamber 80 including a gas delivery apparatus 130 adapted for cyclicdeposition, such as atomic layer deposition or rapid chemical vapordeposition. A detailed description for a chamber 80 is described incommonly assigned U.S. Pat. No. 6,916,398, and commonly assigned andco-pending U.S. Ser. No. 10/281,079, entitled “Gas Delivery Apparatusfor Atomic Layer Deposition,” filed Oct. 25, 2002, and published as US2003-0121608, which are both incorporated herein by reference in theirentirety. The terms “atomic layer deposition” (ALD) and “rapid chemicalvapor deposition,” as used herein, refer to the sequential introductionof reactants to deposit a thin layer over a substrate structure. Thesequential introduction of reactants may be repeated to deposit aplurality of thin layers to form a conformal layer to a desiredthickness. The chamber 80 may also be adapted for other depositiontechniques.

The chamber 80 contains a chamber body 82 having sidewalls 84 and abottom 86. A slit valve 88 in the chamber 80 provides access for a robot(not shown) to deliver and retrieve a substrate 90, such as a 200 mm or300 mm semiconductor wafer or a glass substrate, from the chamber 80.

A substrate support 92 supports the substrate 90 on a substratereceiving surface 91 in the chamber 80. The substrate support 92 ismounted to a lift motor 114 to raise and lower the substrate support 92and a substrate 90 disposed thereon. A lift plate 116 connected to alift motor 118 is mounted in the chamber 80 and raises and lowers pins120 movably disposed through the substrate support 92. The pins 120raise and lower the substrate 90 over the surface of the substratesupport 92. The substrate support 92 may include a vacuum chuck, anelectrostatic chuck, or a clamp ring for securing the substrate 90 tothe substrate support 92 during processes.

The substrate support 92 may be heated to heat a substrate 90 disposedthereon. For example, the substrate support 92 may be heated using anembedded heating element, such as a resistive heater, or may be heatedusing radiant heat, such as heating lamps disposed above the substratesupport 92. A purge ring 122 may be disposed on the substrate support 92to define a purge channel 124 which provides a purge gas to a peripheralportion of the substrate 90 to prevent deposition thereon.

A gas delivery apparatus 130 is disposed at an upper portion of thechamber body 82 to provide a gas, such as a process gas and/or a purgegas, to the chamber 80. A vacuum system 178 is in communication with apumping channel 179 to evacuate any desired gases from the chamber 80and to help maintain a desired pressure or a desired pressure rangeinside a pumping zone 166 of the chamber 80.

In one embodiment, the chambers depicted by FIGS. 1 and 2 permit theprocess gas and/or purge gas to enter the chamber 80 normal (i.e., 900)with respect to the plane of the substrate 90 via the gas deliveryapparatus 130. Therefore, the surface of substrate 90 is symmetricallyexposed to gases that allow uniform film formation on substrates. Inanother embodiment, the process gas may have a circular flow pattern,such as a “vortex,” “helix,” or “spiral” flow passing through theexpanding channel 134 towards the substrate. The circular flow mayestablish a more efficient purge of the expanding channel 134 due to thesweeping action of the vortex flow pattern across the inner surface ofthe expanding channel 134 and a laminar flow efficiently purging thesurface of the chamber lid 132 and the substrate 90. The process gasincludes a ruthenium-containing precursor during one pulse and includesa reducing gas in another pulse.

Chamber 80, depicted in FIG. 2, produces a more uniform film thanchamber 10, depicted in FIG. 1. Also, chamber 80 employs a smaller cycletime than chamber 10, since chamber 80 takes less time to purge and lesstime to dose the wafer to saturation with precursor than chamber 10. Thelesser dosing time is important because many of the ruthenium-containingcompounds have the inherent characteristic of a low vapor pressure. Thelow vapor pressure correlates to less precursor saturating the carriergas per time and temperature, therefore, more time is needed to saturatethe surface of the wafer with ruthenium-containing compound (e.g.,Cp₂Ru) than a traditional precursor with a higher vapor pressure (e.g.,TiCl₄). Therefore, chamber 10 may dose a ruthenium-containing compoundfor about 1 second or less, while chamber 80 may dose the sameruthenium-containing compound for about 0.2 seconds or less.

In one embodiment, the gas delivery apparatus 130 comprises a chamberlid 132. The chamber lid 132 includes an expanding channel 134 extendingfrom a central portion of the chamber lid 132 and a bottom surface 160extending from the expanding channel 134 to a peripheral portion of thechamber lid 132. The bottom surface 160 is sized and shaped tosubstantially cover a substrate 90 disposed on the substrate support 92.The expanding channel 134 has gas inlets 136A, 136B to provide gas flowsfrom two similar pairs of valves 142A/152A, 142B/152B, which may beprovided together and/or separately.

In one configuration, valve 142A and valve 142B are coupled to separatereactant gas sources but are preferably coupled to the same purge gassource. For example, valve 142A is coupled to reactant gas source 138and valve 142B is coupled to reactant gas source 139, and both valves142A, 142B are coupled to purge gas source 140. Each valve 142A, 142Bincludes a delivery line 143A, 143B having a valve seat assembly 144A,144B and each valves 152A, 152B includes a purge line 145A, 145B havinga valve seat assembly 146A, 146B. The delivery line 143A, 143B is incommunication with the reactant gas source 138, 139 and is incommunication with the gas inlet 136A, 136B of the expanding channel134. The valve seat assembly 144A, 144B of the delivery line 143A, 143Bcontrols the flow of the reactant gas from the reactant gas source 138,139 to the expanding channel 134. The purge line 145A, 145B is incommunication with the purge gas source 140 and intersects the deliverylines 143A, 143B downstream of the valve seat assembly 144A, 144B of thevalves 142A, 142B. The valve seat assembly 146A, 146B of the purge line145A, 145B controls the flow of the purge gas from the purge gas source140 to the delivery line 143A, 143B. If a carrier gas is used to deliverreactant gases from the reactant gas source 138, 139, preferably thesame gas is used as a carrier gas and a purge gas (i.e., an argon gasused as a carrier gas and a purge gas).

Each valve seat assembly 144A, 144B, 146A, 146B may comprise a diaphragmand a valve seat. The diaphragm may be biased open or closed and may beactuated closed or open respectively. The diaphragms may bepneumatically actuated or may be electrically actuated. Examples ofpneumatically actuated valves include pneumatically actuated valvesavailable from Fujiken and Veriflow. Examples of electrically actuatedvalves include electrically actuated valves available from Fujiken.Programmable logic controllers 148A, 148B may be coupled to the valves142A, 142B to control actuation of the diaphragms of the valve seatassemblies 144A, 144B, 146A, 146B of the valves 142A, 142B.Pneumatically actuated valves may provide pulses of gases in timeperiods as low as about 0.020 seconds. Electrically actuated valves mayprovide pulses of gases in time periods as low as about 0.005 seconds.An electrically actuated valve typically requires the use of a drivercoupled between the valve and the programmable logic controller.

Each valve 142A, 142B may be a zero dead volume valve to enable flushingof a reactant gas from the delivery line 143A, 143B when the valve seatassembly 144A, 144B of the valve is closed. For example, the purge line145A, 145B may be positioned adjacent the valve seat assembly 144A, 144Bof the delivery line 143A, 143B. When the valve seat assembly 144A, 144Bis closed, the purge line 145A, 145B may provide a purge gas to flushthe delivery line 143A, 143B. In the embodiment shown, the purge line145A, 145B is positioned slightly spaced from the valve seat assembly144A, 144B of the delivery line 143A, 143B so that a purge gas is notdirectly delivered into the valve seat assembly 144A, 144B when open. Azero dead volume valve as used herein is defined as a valve which hasnegligible dead volume (i.e., not necessary zero dead volume).

Each valve pair 142A/152A, 142B/152B may be adapted to provide acombined gas flow and/or separate gas flows of the reactant gas 138, 139and the purge gas 140. In reference to valve pair 142A/152A, one exampleof a combined gas flow of the reactant gas 138 and the purge gas 140provided by valve 142A comprises a continuous flow of a purge gas fromthe purge gas source 140 through purge line 145A and pulses of areactant gas from the reactant gas source 138 through delivery line143A. The continuous flow of the purge gas may be provided by leavingdiaphragm of the valve seat assembly 146A of the purge line 145A open.The pulses of the reactant gas from the reactant gas source 138 may beprovided by opening and closing the diaphragm of the valve seat 144A ofthe delivery line 143A. In reference to valve pair 142A/152A, oneexample of separate gas flows of the reactant gas 138 and the purge gas140 provided by valve 142A comprises pulses of a purge gas from thepurge gas source 140 through purge line 145A and pulses of a reactantgas from the reactant gas source 138 through delivery line 143A. Thepulses of the purge gas may be provided by opening and closing thediaphragm of the valve seat assembly 146A of the purge line 145A open.The pulses of the reactant gas from the reactant gas source 138 may beprovided by opening and closing the diaphragm valve seat 144A of thedelivery line 143A.

The delivery lines 143A, 143B of the valves 142A, 142B may be coupled tothe gas inlets 136A, 136B through gas conduits 150A, 150B. The gasconduits 150A, 150B may be integrated or may be separate from the valves142A, 142B. In one aspect, the valves 142A, 142B are coupled in closeproximity to the expanding channel 134 to reduce any unnecessary volumeof the delivery line 143A, 143B and the gas conduits 150A, 150B betweenthe valves 142A, 142B and the gas inlets 136A, 136B.

In FIG. 2, the expanding channel 134 comprises a channel which has aninner diameter which increases from an upper portion 137 of cap 172 to alower portion 135 of the expanding channel 134 adjacent the bottomsurface 160 of the chamber lid 132.

In one specific embodiment, the inner diameter of the expanding channel134 for a chamber adapted to process 200 mm diameter substrates isbetween about 0.2 inches (0.51 cm) and about 1.0 inch (2.54 cm), morepreferably between about 0.3 inches (0.76 cm) and about 0.9 inches (2.29cm) and more preferably between about 0.3 inches (0.76 cm) and about 0.5inches (1.27 cm) at the upper portion 137 of the expanding channel 134and between about 0.5 inches (1.27 cm) and about 3.0 inches (7.62 cm),preferably between about 0.75 inches (1.91 cm) and about 2.5 inches(6.35 cm) and more preferably between about 1.1 inches (2.79 cm) andabout 2.0 inches (5.08 cm) at the lower portion 135 of the expandingchannel 134.

In another specific embodiment, the inner diameter of the expandingchannel 134 for a chamber adapted to process 300 mm diameter substratesis between about 0.2 inches (0.51 cm) and about 1.0 inch (2.54 cm), morepreferably between about 0.3 inches (0.76 cm) and about 0.9 inches (2.29cm) and more preferably between about 0.3 inches (0.76 cm) and about 0.5inches (1.27 cm) at the upper portion 137 of the expanding channel 134and between about 0.5 inches (1.27 cm) and about 3.0 inches (7.62 cm),preferably between about 0.75 inches (1.91 cm) and about 2.5 inches(6.35 cm) and more preferably between about 1.2 inches (3.05 cm) andabout 2.2 inches (5.59 cm) at the lower portion 135 of the expandingchannel 134 for a 300 mm substrate. In general, the above dimensionapply to an expanding channel adapted to provide a total gas flow ofbetween about 500 sccm and about 3,000 sccm.

In other specific embodiments, the dimension may be altered toaccommodate a certain gas flow therethrough. In general, a larger gasflow will require a larger diameter expanding channel. In oneembodiment, the expanding channel 134 may be shaped as a truncated cone(including shapes resembling a truncated cone). Whether a gas isprovided toward the walls of the expanding channel 134 or directlydownward towards the substrate, the velocity of the gas flow decreasesas the gas flow travels through the expanding channel 134 due to theexpansion of the gas. The reduction of the velocity of the gas flowhelps reduce the likelihood the gas flow will blow off reactantsabsorbed on the surface of the substrate 90.

Not wishing to be bound by theory, it is believed that the diameter ofthe expanding channel 134, which is gradually increasing from the upperportion 137 to the lower portion 135 of the expanding channel, allowsless of an adiabatic expansion of a gas through the expanding channel134 which helps to control the temperature of the gas. For instance, asudden adiabatic expansion of a gas delivered through the gas inlet136A, 136B into the expanding channel 134 may result in a drop in thetemperature of the gas which may cause condensation of the gas andformation of particles. On the other hand, a gradually expanding channel134 according to embodiments of the present invention is believed toprovide less of an adiabatic expansion of a gas. Therefore, more heatmay be transferred to or from the gas, and, thus, the temperature of thegas may be more easily controlled by controlling the surroundingtemperature of the gas (i.e., controlling the temperature of the chamberlid 132). The gradually expanding channel may contain one or moretapered inner surfaces, such as a tapered straight surface, a concavesurface, a convex surface, or a combination thereof or may containsections of one or more tapered inner surfaces (i.e., a portion tapered,such as bottom surface 160 and a portion non-tapered, such as choke162).

In one embodiment, the gas inlets 136A, 136B are located adjacent theupper portion 137 of the expanding channel 134. In other embodiments,one or more gas inlets may be located along the length of the expandingchannel 134 between the upper portion 137 and the lower portion 135.

In FIG. 2, a control unit 180, such as a programmed personal computer,work station computer, or the like, may be coupled to the chamber 80 tocontrol processing conditions. For example, the control unit 180 may beconfigured to control flow of various process gases and purge gases fromgas sources 138, 139, 140 through the valves 142A, 142B during differentstages of a substrate process sequence. Illustratively, the control unit180 comprises a central processing unit (CPU) 182, support circuitry184, and memory 186 containing associated control software 183.

The control unit 180 may be one of any form of general purpose computerprocessor that can be used in an industrial setting for controllingvarious chambers and sub-processors. The CPU 182 may use any suitablememory 186, such as random access memory, read only memory, floppy diskdrive, compact disc drive, hard disk, or any other form of digitalstorage, local or remote. Various support circuits may be coupled to theCPU 182 for supporting the chamber 80. The control unit 180 may becoupled to another controller that is located adjacent individualchamber components, such as the programmable logic controllers 148A,148B of the valves 142A, 142B. Bi-directional communications between thecontrol unit 180 and various other components of the chamber 80 arehandled through numerous signal cables collectively referred to assignal buses 188, some of which are illustrated in FIG. 2. In additionto control of process gases and purge gases from gas sources 138, 139,140 and from the programmable logic controllers 148A, 148B of the valves142A, 142B, 152A, 152B the control unit 180 may be configured to beresponsible for automated control of other activities used in waferprocessing—such as wafer transport, temperature control, chamberevacuation, among other activities, some of which are describedelsewhere herein.

Noble Metal Layer Formation

A method of noble metal layer formation for high aspect ratiointerconnect features is described. The noble metal layer is depositedusing a cyclical deposition process. The cyclical deposition processprovides alternately adsorbing a noble metal-containing precursor and areducing gas on a substrate structure. The noble metal-containingprecursor and the reducing gas undergo a reaction to form the noblemetal layer on the substrate. Suitable noble metals may include, forexample, ruthenium, palladium, platinum, cobalt, nickel, or rhodium,preferably ruthenium. The ruthenium layer may have a thickness of lessthan about 500 Å, preferably, within a range from about 10 Å to about100 Å, such as about 30 Å.

FIG. 3 illustrates a process sequence 100 detailing the various stepsused for the deposition of the silicon layer. These steps may beperformed in a process chamber similar to that described above withreference to FIGS. 1 and 2. As shown in step 102, a substrate isprovided to the process chamber. The substrate may be for example, asilicon substrate having an interconnect pattern defined in one or moredielectric material layers formed thereon. The process chamberconditions such as, for example, the temperature and pressure areadjusted to enhance the adsorption of the process gases on the substrateso as to facilitate the reaction of the noble metal-containing precursor(e.g., ruthenium metallocene) and the reducing gas. In general, fornoble metal layer deposition, the substrate should be maintained at atemperature of less than about 500° C., preferably, within a range fromabout 200° C. to about 400° C., such as about 350° C. The processchamber pressure is maintained within a range from about 0.1 Torr toabout 80 Torr, preferably, from about 1 Torr to about 10 Torr. The noblemetal-containing precursor may be provided having a flow rate within arange from about 0.01 sccm to about 20 sccm, preferably, from about 0.1sccm to about 5 sccm, and more preferably, from about 0.1 sccm to about1 sccm. The reducing gas may be provided having a flow rate within arange from about 1 sccm to about 100 sccm, preferably, from about 10sccm to about 50 sccm.

In one embodiment where a constant carrier gas flow is desired, acarrier gas stream is established within the process chamber asindicated in step 104. Carrier gases may be selected so as to also actas a purge gas for the removal of volatile reactants and/or by-productsfrom the process chamber. A carrier gas or a purge gas that may be usedduring processes described herein include helium (He), argon (Ar),nitrogen (N₂), hydrogen (H₂), or combinations thereof. The pulse of thepurge gas lasts for a predetermined time interval, such as, within arange from about 0.01 seconds to about 10 seconds, preferably, fromabout 0.07 seconds to about 2 seconds, and more preferably, from about0.1 seconds to about 1 second. The carrier gas and purge gases may beprovided having a flow rate within a range from about 500 sccm to about5,000 sccm, preferably, from about 500 sccm to about 2,500 sccm for 200mm substrates and from about 1,000 sccm to about 5,000 sccm for 300 mmsubstrates.

Referring to step 106, after the carrier gas stream is establishedwithin the process chamber, a pulse of a noble metal-containingprecursor is added to the carrier gas stream. The term pulse as usedherein refers to a dose of material injected into the process chamber orinto the carrier gas stream. The pulse of the noble metal-containingprecursor lasts for a predetermined time interval, such as, within arange from about 0.01 seconds to about 10 seconds, preferably, fromabout 0.05 seconds to about 1.5 seconds, and more preferably, from about0.1 seconds to about 1 second.

The noble metal-containing precursors may contain noble metals, such asruthenium, palladium, platinum, cobalt, nickel, or rhodium. Suitableruthenium-containing precursors includetris(2,2,6,6-tetramethyl-3,5-heptanedionato) ruthenium,bis(2,4-dimethylpentadienyl) ruthenium, dicarbonyl pentadienylruthenium, ruthenium acetyl acetonate, (2,4-dimethylpentadienyl)ruthenium (cyclopentadienyl),bis(2,2,6,6-tetramethyl-3,5-heptanedionato) ruthenium(1,5-cyclooctadiene),(2,4-dimethylpentadienyl)ruthenium(methylcyclopentadienyl),(1,5-cyclooctadiene)ruthenium(cyclopentadienyl),(1,5-cyclooctadiene)ruthenium(methylcyclopentadienyl),(1,5-cyclooctadiene)ruthenium(ethylcyclopentadienyl),(2,4-dimethylpentadienyl) ruthenium(ethylcyclopentadienyl),(2,4-dimethylpentadienyl)ruthenium(isopropylcyclopentadienyl),bis(N,N-dimethyl 1,3-tetramethyldiiminato)ruthenium(1,5-cyclooctadiene), bis(N,N-dimethyl 1,3-dimethyldiiminato)ruthenium(1,5-cyclooctadiene),bis(allyl)ruthenium(1,5-cyclooctadiene), (η⁶-C₆H₆) ruthenium(1,3-cyclohexadiene),bis(1,1-dimethyl-2-aminoethoxylato)ruthenium(1,5-cyclooctadiene), orbis(1,1-dimethyl-2-aminoethylaminato)ruthenium (1,5-cyclooctadiene).Suitable palladium-containing precursors include bis(allyl)palladium,bis(2-methylallyl)palladium, or (cyclopentadienyl)palladium(allyl).Suitable platinum-containing precursors include dimethyl platinum(cyclooctadiene), trimethyl platinum (cyclopentadienyl),trimethyl(methylcyclopentadienyl) platinum, cyclopentadienyl(allyl)platinum, methyl(carbonyl) platinum cyclopentadienyl, trimethyl platinum(acetylacetonato), and bis(acetylacetonato) platinum. Suitablecobalt-containing precursors include bis(cyclopentadienyl) cobalt,(cyclopentadienyl) cobalt (cyclohexadienyl),cyclopentadienyl(1,3-hexadienyl) cobalt, (cyclobutadienyl) cobalt(cyclopentadienyl), bis(methylcyclopentadienyl) cobalt,(cyclopentadienyl) cobalt (5-methylcyclopentadienyl), or bis(ethylene)cobalt (pentamethylcyclopentadienyl). A suitable nickel-containingprecursor includes bis(methylcyclopentadienyl) nickel. Suitablerhodium-containing precursors include bis(carbonyl) rhodium(cyclopentadienyl), bis(propylene) rhodium, bis(carbonyl) rhodium(ethylcyclopentadienyl), or bis(carbonyl) rhodium(methylcyclopentadienyl).

The time interval for the pulse of the noble metal-containing precursoris variable depending upon a number of factors such as, for example, thevolume capacity of the process chamber employed, the vacuum systemcoupled thereto and the volatility/reactivity of the reactants used. Forexample, (1) a large-volume process chamber may lead to a longer time tostabilize the process conditions such as, for example, carrier/purge gasflow and temperature, requiring a longer pulse time; (2) a lower flowrate for the process gas may also lead to a longer time to stabilize theprocess conditions requiring a longer pulse time; and (3) a lowerchamber pressure means that the process gas is evacuated from theprocess chamber more quickly requiring a longer pulse time. In general,the process conditions are advantageously selected so that a pulse ofthe noble metal-containing precursor provides a sufficient amount ofprecursor so that at least a monolayer of the noble metal-containingprecursor is adsorbed on the substrate. Thereafter, excess noblemetal-containing precursor remaining in the chamber may be removed fromthe process chamber by the constant carrier gas stream in combinationwith the vacuum system.

In step 108, after the excess noble metal-containing precursor has beenflushed from the process chamber by the carrier gas stream, a pulse of areducing gas is added to the carrier gas stream. The pulse of thereducing gas also lasts for a predetermined time interval. In general,the time interval for the pulse of the reducing gas should be longenough for adsorption of at least a monolayer of the reducing gas on thenoble metal-containing precursor. The pulse of reducing gas lasts for apredetermined time interval, such as, within a range from about 0.01seconds to about 10 seconds, preferably, from about 0.1 seconds to about2 seconds, and more preferably, from about 0.1 seconds to about 1second. Thereafter, excess reducing gas is flushed from the processchamber by the carrier gas stream. Suitable reducing gases may include,for example, hydrogen (e.g., H₂ or atomic-H), ammonia (NH₃), silane(SiH₄), disilane (Si₂H₆), trisilane (Si₃H₈), tetrasilane (Si₄H₁₀),dimethylsilane (SiC₂H₈), methyl silane (SiCH₆), ethylsilane (SiC₂H₈),chlorosilane (ClSiH₃), dichlorosilane (Cl₂SiH₂), hexachlorodisilane(Si₂Cl₆), borane, diborane, triborane, tetraborane, pentaborane,triethylborane, or combinations thereof.

In one embodiment, a deposition cycle for forming a noble metal layer isdepicted by steps 104-108 in FIG. 3. A constant flow of carrier gas isprovided to the process chamber modulated by alternating periods ofpulsing and non-pulsing where the periods of pulsing alternate betweenthe noble metal-containing precursor and the reducing gas along with thecarrier gas stream, while the periods of non-pulsing include only thecarrier gas stream.

The time interval for each of the pulses of the noble metal-containingprecursor and the reducing gas may have the same duration. That is, theduration of the pulse of the noble metal-containing precursor may beidentical to the duration of the pulse of the reducing gas. For such anembodiment, a time interval (T₁) for the pulse of the noblemetal-containing precursor is equal to a time interval (T₂) for thepulse of the reducing gas.

Alternatively, the time interval for each of the pulses of the noblemetal-containing precursor and the reducing gas may have differentdurations. That is, the duration of the pulse of the noblemetal-containing precursor may be shorter or longer than the duration ofthe pulse of the reducing gas. For such an embodiment, a time interval(T₁) for the pulse of the noble metal-containing precursor is differentthan the time interval (T₂) for the pulse of the reducing gas.

In addition, the periods of non-pulsing between each of the pulses ofthe noble metal-containing precursor and the reducing gas may have thesame duration. That is, the duration of the period of non-pulsingbetween each pulse of the noble metal-containing precursor and eachpulse of the reducing gas is identical. For such an embodiment, a timeinterval (T₃) of non-pulsing between the pulse of the noblemetal-containing precursor and the pulse of the reducing gas is equal toa time interval (T₄) of non-pulsing between the pulse of the reducinggas and the pulse of the noble metal-containing precursor. During thetime periods of non-pulsing only the constant carrier gas stream isprovided to the process chamber.

Alternatively, the periods of non-pulsing between each of the pulses ofthe noble metal-containing precursor and the reducing gas may havedifferent duration. That is, the duration of the period of non-pulsingbetween each pulse of the noble metal-containing precursor and eachpulse of the reducing gas may be shorter or longer than the duration ofthe period of non-pulsing between each pulse of the reducing gas and thenoble metal-containing precursor. For such an embodiment, a timeinterval (T₃) of non-pulsing between the pulse of the noblemetal-containing precursor and the pulse of the reducing gas isdifferent from a time interval (T₄) of non-pulsing between the pulse ofthe reducing gas and the pulse of noble metal-containing precursor.During the time periods of non-pulsing only the constant carrier gasstream is provided to the process chamber.

Additionally, the time intervals for each pulse of the noblemetal-containing precursor, the reducing gas and the periods ofnon-pulsing therebetween for each deposition cycle may have the sameduration. For such an embodiment, a time interval (T₁) for the noblemetal-containing precursor, a time interval (T₂) for the reducing gas, atime interval (T₃) of non-pulsing between the pulse of the noblemetal-containing precursor and the pulse of the reducing gas and a timeinterval (T₄) of non-pulsing between the pulse of the reducing gas andthe pulse of the noble metal-containing precursor each have the samevalue for each deposition cycle. For example, in a first depositioncycle (C₁), a time interval (T₁) for the pulse of the noblemetal-containing precursor has the same duration as the time interval(T₁) for the pulse of the noble metal-containing precursor in subsequentdeposition cycles (C₂ . . . C_(n)). Similarly, the duration of eachpulse of the reducing gas and the periods of non-pulsing between thepulse of the noble metal-containing precursor and the reducing gas inthe first deposition cycle (C₁) is the same as the duration of eachpulse of the reducing gas and the periods of non-pulsing between thepulse of the noble metal-containing precursor and the reducing gas insubsequent deposition cycles (C₂ . . . C_(n)), respectively.

Alternatively, the time intervals for at least one pulse of the noblemetal-containing precursor, the reducing gas and the periods ofnon-pulsing therebetween for one or more of the deposition cycles of thenoble metal layer deposition process may have different durations. Forsuch an embodiment, one or more of the time intervals (T₁) for thepulses of the noble metal-containing precursor, the time intervals (T₂)for the pulses of the reducing gas, the time intervals (T₃) ofnon-pulsing between the pulse of the noble metal-containing precursorand the reducing gas and the time intervals (T₄) of non-pulsing betweenthe pulses of the reducing gas and the noble metal-containing precursormay have different values for one or more deposition cycles of thecyclical deposition process. For example, in a first deposition cycle(C₁), the time interval (T₁) for the pulse of the noble metal-containingprecursor may be longer or shorter than one or more time interval (T₁)for the pulse of the noble metal-containing precursor in subsequentdeposition cycles (C₂ . . . C_(n)). Similarly, the durations of thepulses of the reducing gas and the periods of non-pulsing between thepulse of the noble metal-containing precursor and the reducing gas inthe first deposition cycle (C₁) may be the same or different than theduration of each pulse of the reducing gas and the periods ofnon-pulsing between the pulse of the noble metal-containing precursorand the reducing gas in subsequent deposition cycles (C₂ . . . C_(n)).

Referring to step 110, after each deposition cycle (steps 104 through108) a thickness of the noble metal will be formed on the substrate.Depending on specific device requirements, subsequent deposition cyclesmay be needed to achieve a desired thickness. As such, steps 104 through108 are repeated until the desired thickness for the noble metal layeris achieved. Thereafter, when the desired thickness for the noble metallayer is achieved the process is stopped as indicated by step 112.

In an alternate process sequence described with respect to FIG. 4, thenoble metal layer deposition cycle comprises separate pulses for each ofthe noble metal-containing precursor, the reducing gas and a purge gas.For such an embodiment, the noble metal layer deposition sequence 200includes providing a substrate to the process chamber (step 202),providing a first pulse of a purge gas to the process chamber (step204), providing a pulse of a noble metal-containing precursor to theprocess chamber (step 206), providing a second pulse of the purge gas tothe process chamber (step 208), providing a pulse of a reducing gas tothe process chamber (step 210), and then repeating steps 204 through210, or stopping the deposition process (step 214) depending on whethera desired thickness for the noble metal layer has been achieved (step212).

The time intervals for each of the pulses of the noble metal-containingprecursor, the reducing gas and the purge gas may have the same ordifferent durations as discussed above with respect to FIG. 3.Alternatively, corresponding time intervals for one or more pulses ofthe noble metal-containing precursor, the reducing gas and the purge gasin one or more of the deposition cycles of the noble metal layerdeposition process may have different durations.

In FIGS. 3-4, the noble metal layer deposition cycle is depicted asbeginning with a pulse of the noble metal-containing precursor followedby a pulse of the reducing gas. Alternatively, the noble metal layerdeposition cycle may start with a pulse of the reducing gas followed bya pulse of the noble metal-containing precursor.

In one example, a method for depositing a ruthenium layer by an ALDprocess includes positioning a substrate (e.g., 300 mm diameter) intothe process chamber 80 of FIG. 2. The method includes providing pulsesof a ruthenium-containing compound, such as bis(2,4-dimethylpentadienyl)ruthenium, from gas source 138 through valve 142A, having a flow ratewithin a large from about 0.01 sccm to about 5 sccm, preferably, fromabout 0.1 sccm to about 1 sccm. A pulse time of about 1.5 seconds orless, such as about 0.1 seconds or less, and as low as about 0.05seconds or less may be used for the ruthenium-containing compound due tothe smaller volume of the reaction zone 164 (as compared to chamber 8 ofFIG. 1). The process further includes providing pulses of a reducinggas, such as diborane (B₂H₆), from gas source 139 through valve 142B,having a flow rate within a range from about 1 sccm to about 80 sccm,preferably, from about 10 sccm to about 50 sccm. A pulse time of about 2seconds or less, about 1 second or less, or about 0.1 seconds or lessmay be used for the reducing gas due to a smaller volume of the reactionzone 164. An argon purge gas having a flow rate within a range fromabout 500 sccm to about 5,000 sccm, preferably, from about 1,500 sccm toabout 3,500 sccm, may be continuously provided from gas source 140through valves 142A, 142B. The time between pulses ofbis(2,4-dimethylpentadienyl) ruthenium and B₂H₆ may be about 0.5 secondsor less, such as about 0.1 seconds or less, and as low as about 0.07seconds or less due to the smaller volume of the reaction zone 164. Itis believed to fill a reaction zone with a reactant gas and/or purgegas, pulse times as low as about 0.016 seconds are sufficient, withcorrespondingly shorter pulse times for a reaction zone 164 sized forsmaller wafers (e.g., 200 mm). The substrate may be heated to atemperature within a range from about 200° C. to about 400° C.,preferably, about 350° C., and the chamber may be pressurized at apressure within a range from about 1.0 to about 10 Torr, preferably,about 4 Torr. A process provides a ruthenium layer having a thicknesswithin a range from about 0.5 Å to about 1.0 Å per cycle. Thealternating sequence of the cycle may be repeated to obtain a desiredthickness of the ruthenium layer.

In one embodiment, the ruthenium layer is deposited on a sidewall with athickness coverage of about 50 Å or less. In another embodiment, theruthenium layer is deposited on a sidewall with a thickness coverage ofabout 20 Å or less. In still another embodiment, the ruthenium layer isdeposited on a sidewall with a thickness coverage of about 10 Å or less.A ruthenium layer having a thickness of about 10 Å or less is believedto be a sufficient thickness as an underlayer to adhere copperdeposition (i.e., seed layer) and to prevent copper diffusion (i.e.,barrier layer). In one aspect, a thin ruthenium underlayer may beadvantageously used prior to filling sub-micron (e.g., less than 0.15μm) and smaller features having high aspect ratios (e.g., greater than 5to 1). Of course, a layer may also be used that has a sidewall with athickness coverage of greater than 50 Å. In one embodiment, a rutheniummaterial is deposited as a seed layer. In another embodiment, aruthenium material is deposited as a barrier layer.

Formation of Copper Interconnects

FIGS. 5A-5C illustrate cross-sectional views of different stages of acopper interconnect being fabricated by sequences that incorporate anoble metal layer formed during a process as described herein. FIG. 5A,for example, illustrates a cross-sectional view of a substrate 300having metal contacts 304 and a dielectric layer 302 formed thereon. Thesubstrate 300 may contain a semiconductor material such as, for example,silicon, germanium, or gallium arsenide. The dielectric layer 302 maycontain an insulating material such as, for example, silicon oxide orsilicon nitride. The metal contacts 304 may contain for example, copper.Apertures 304H may be defined in the dielectric layer 302 to provideopenings over the metal contacts 304. The apertures 304H may be definedin the dielectric layer 302 using conventional lithography and etchingtechniques.

A barrier layer 306 may be formed in the apertures 304H defined in thedielectric layer 302. The barrier layer 306 may include one or morerefractory metal-containing layers such as, for example, titanium,titanium nitride, tantalum, tantalum nitride, tungsten, or tungstennitride. The barrier layer 306 may be formed using a suitable depositionprocess. For example, titanium nitride may be deposited using a chemicalvapor deposition (CVD) process or ALD process wherein titaniumtetrachloride and ammonia are reacted.

Referring to FIG. 5B, a noble metal layer 308 (e.g., ruthenium) isformed on the barrier layer 306. The noble metal layer is formed usingthe cyclical deposition techniques described above with reference toFIGS. 3-4. The thickness for the noble metal layer is variable dependingon the device structure to be fabricated. Typically, the thickness ofthe noble metal layer is less than about 100 Å, preferably, within arange from about 10 Å to about 60 Å. In one embodiment, a rutheniumlayer has a thickness of about 30 Å.

Thereafter, referring to FIG. 5C, the apertures 304H may be filled withcopper 310 to complete the copper interconnect. The copper 310 may beformed using one or more suitable deposition processes. In oneembodiment, for example, a copper seed layer may be formed on theruthenium layer by using a CVD process followed by deposition of bulkcopper to fill the interconnects using an electrochemical plating (ECP)process. In another embodiment, a copper seed layer is deposited to theruthenium layer via physical vapor deposition (PVD), thereafter anelectroless copper plating is utilized to deposit a copper bulk fill. Inanother embodiment, the ruthenium layer serves as a seed layer to whicha copper bulk fill is directly deposited with ECP or electroless copperplating.

Several integration sequence are conducted in order to form a rutheniumlayer within the interconnect. In one embodiment, the subsequent stepsfollow: a) pre-clean of the substrate; b) deposition of a barrier layer(e.g., ALD of TaN); c) deposition of ruthenium by ALD; and d) depositionof copper by ECP or Cu-PVD followed by ECP. In another embodiment, thesubsequent steps follow: a) deposition of a barrier layer (e.g., ALD ofTaN); b) punch-through step; c) deposition of ruthenium by ALD; and d)deposition of copper by ECP or Cu-PVD followed by ECP. In anotherembodiment, the subsequent steps follow: a) deposition of ruthenium byALD; b) punch-through step; c) deposition of ruthenium by ALD; and d)deposition of copper by ECP or Cu-PVD followed by ECP or Cu-PVD. Inanother embodiment, the subsequent steps follow: a) deposition ofruthenium by ALD; b) punch-through step; c) deposition of ruthenium byALD; and d) deposition of copper by ECP. In another embodiment, thesubsequent steps follow: a) pre-clean of the substrate; b) deposition ofruthenium by ALD; and c) deposition of copper by ECP or Cu-PVD followedby ECP.

The pre-clean steps include methods to clean or purify the via, such asthe removal of residue at the bottom of the via (e.g., carbon) orreduction of copper oxide to copper metal. Punch-through steps include asputtering method to remove material (e.g., barrier layer) with a plasmafrom the bottom of the via to expose conductive layer, such as copper.Further disclosure of punch-through steps are described in more detailin the commonly assigned, U.S. Pat. No. 6,498,091, and is hereinincorporated by reference. The punch-through steps may be conducted in aprocess chamber, such as either a barrier chamber or a clean chamber. Inembodiments of the invention, clean steps and punch-through steps areapplied to ruthenium barrier layers. Further disclosure of overallintegrated methods are described in more detail in the commonlyassigned, U.S. Ser. No. 60/478,663, entitled “Integration of ALDTantalum Nitride for Copper Metallization”, filed Jun. 13, 2003, and isherein incorporated by reference.

While foregoing is directed to the preferred embodiment of theinvention, other and further embodiments of the invention may be devisedwithout departing from the basic scope thereof, and the scope thereof isdetermined by the claims that follow.

1. A method for forming a material on a substrate, comprising:positioning a substrate containing a dielectric material within aprocess chamber, wherein vias are contained within the dielectricmaterial and each via has a bottom surface and sidewalls; forming abarrier layer within the vias and on the dielectric material during abarrier layer deposition process; forming a ruthenium layer on thebarrier layer during a ruthenium deposition process; exposing a contactlayer within the vias by removing material from the bottom surfaceduring a punch-through step; and filling the vias with a copper materialduring a copper deposition process.
 2. The method of claim 1, whereinthe barrier layer contains at least one material selected from the groupconsisting of titanium, titanium nitride, tantalum, tantalum nitride,tungsten, tungsten nitride, a derivative thereof, and a combinationthereof.
 3. The method of claim 2, wherein the barrier layer contains atantalum layer and a tantalum nitride layer.
 4. The method of claim 1,wherein the copper material contains a copper seed layer and a copperbulk layer.
 5. The method of claim 4, wherein the copper seed layer isdeposited by an electroless chemical plating process and the copper bulklayer is deposited by an electrochemical plating process.
 6. The methodof claim 4, wherein the copper seed layer and the copper bulk layer aredeposited by electroless chemical plating processes.
 7. The method ofclaim 4, wherein the copper seed layer is deposited by a chemical vapordeposition process and the copper bulk layer is deposited by anelectrochemical plating process.
 8. The method of claim 4, wherein thecopper seed layer is deposited by a physical vapor deposition processand the copper bulk layer is deposited by an electrochemical platingprocess.
 9. The method of claim 1, wherein the ruthenium layer isdeposited by exposing the substrate to a ruthenium precursor during anatomic layer deposition process.
 10. The method of claim 9, wherein theruthenium precursor contains a 2,4-dimethylpentadienyl ligand.
 11. Themethod of claim 9, wherein the ruthenium precursor is selected from thegroup consisting of bis(2,4-dimethylpentadienyl) ruthenium,(2,4-dimethylpentadienyl) ruthenium (cyclopentadienyl),(2,4-dimethylpentadienyl) ruthenium (methylcyclopentadienyl),(2,4-dimethylpentadienyl) ruthenium (ethylcyclopentadienyl),(2,4-dimethylpentadienyl) ruthenium (isopropylcyclopentadienyl),derivatives thereof, and combinations thereof.
 12. The method of claim1, wherein the ruthenium layer is deposited by sequentially exposing thesubstrate to a ruthenium precursor and a reagent during an atomic layerdeposition process.
 13. The method of claim 12, wherein the rutheniumprecursor is selected from the group consisting ofbis(2,4-dimethylpentadienyl)ruthenium,(2,4-dimethylpentadienyl)ruthenium(cyclopentadienyl),(2,4-dimethylpentadienyl)ruthenium(methylcyclopentadienyl),(2,4-dimethylpentadienyl)ruthenium(ethylcyclopentadienyl),(2,4-dimethylpentadienyl) ruthenium (isopropylcyclopentadienyl),derivatives thereof, and combinations thereof.
 14. The method of claim13, wherein the reagent is selected from the group consisting ofhydrogen, atomic hydrogen, ammonia, derivatives thereof, andcombinations thereof.
 15. The method of claim 12, wherein theruthenium-containing compound is selected from the group consisting oftris(2,2,6,6-tetramethyl-3,5-heptanedionato) ruthenium,bis(2,4-dimethylpentadienyl)ruthenium, dicarbonyl pentadienyl ruthenium,ruthenium acetyl acetonate, (2,4-dimethylpentadienyl)ruthenium(cyclopentadienyl),bis(2,2,6,6-tetramethyl-3,5-heptanedionato)ruthenium(1,5-cyclooctadiene),(2,4-dimethylpentadienyl)ruthenium(methylcyclopentadienyl),(1,5-cyclooctadiene)ruthenium(cyclopentadienyl),(1,5-cyclooctadiene)ruthenium(methylcyclopentadienyl),(1,5-cyclooctadiene)ruthenium(ethylcyclopentadienyl),(2,4-dimethylpentadienyl)ruthenium(ethylcyclopentadienyl),(2,4-dimethylpentadienyl)ruthenium(isopropylcyclopentadienyl),bis(N,N-dimethyl 1,3-tetramethyldiiminato)ruthenium(1,5-cyclooctadiene), bis(N,N-dimethyl 1,3-dimethyldiiminato)ruthenium(1,5-cyclooctadiene),bis(allyl)ruthenium(1,5-cyclooctadiene),((6-C₆H₆)ruthenium(1,3-cyclohexadiene),bis(1,1-dimethyl-2-aminoethoxylato)ruthenium(1,5-cyclooctadiene),bis(1,1-dimethyl-2-aminoethylaminato)ruthenium(1,5-cyclooctadiene),derivatives thereof, and combinations thereof.
 16. The method of claim15, wherein the reagent is selected from the group consisting ofhydrogen, atomic hydrogen, ammonia, nitrogen, silane, disilane,dimethylsilane, methylsilane, borane, diborane, triethylborane,derivatives thereof, and combinations thereof.
 17. The method of claim12, wherein the ruthenium layer has a thickness within a range fromabout 10 Å to about 60 Å.
 18. The method of claim 9, wherein theruthenium layer has a thickness of about 30 Å or less.
 19. A method forforming a material on a substrate, comprising: positioning a substratecontaining a dielectric material within a process chamber, wherein viasare contained within the dielectric material and each via has a bottomsurface and sidewalls; forming a barrier layer within the vias and onthe dielectric material during a barrier layer deposition process;exposing a contact layer within the vias by removing material from thebottom surface during a punch-through step; forming a ruthenium layer onthe barrier layer and the contact layer during a ruthenium depositionprocess; and filling the vias with a copper material during a copperdeposition process.
 20. The method of claim 19, wherein the barrierlayer contains at least one material selected from the group consistingof titanium, titanium nitride, tantalum, tantalum nitride, tungsten,tungsten nitride, a derivative thereof, and a combination thereof. 21.The method of claim 20, wherein the barrier layer contains a tantalumlayer and a tantalum nitride layer.
 22. The method of claim 19, whereinthe copper material contains a copper seed layer and a copper bulklayer.
 23. The method of claim 22, wherein the copper seed layer isdeposited by an electroless chemical plating process and the copper bulklayer is deposited by an electrochemical plating process.
 24. The methodof claim 22, wherein the copper seed layer and the copper bulk layer aredeposited by electroless chemical plating processes.
 25. The method ofclaim 22, wherein the copper seed layer is deposited by a chemical vapordeposition process and the copper bulk layer is deposited by anelectrochemical plating process.
 26. The method of claim 22, wherein thecopper seed layer is deposited by a physical vapor deposition processand the copper bulk layer is deposited by an electrochemical platingprocess.
 27. The method of claim 19, wherein the ruthenium layer isdeposited by exposing the substrate to a ruthenium precursor during anatomic layer deposition process.
 28. The method of claim 27, wherein theruthenium precursor contains a 2,4-dimethylpentadienyl ligand.
 29. Themethod of claim 27, wherein the ruthenium precursor is selected from thegroup consisting of bis(2,4-dimethylpentadienyl)ruthenium,(2,4-dimethylpentadienyl)ruthenium(cyclopentadienyl),(2,4-dimethylpentadienyl)ruthenium(methylcyclopentadienyl),(2,4-dimethylpentadienyl)ruthenium(ethylcyclopentadienyl), (2,4-dimethylpentadienyl)ruthenium(isopropylcyclopentadienyl), derivatives thereof,and combinations thereof.
 30. The method of claim 19, wherein theruthenium layer is deposited by sequentially exposing the substrate to aruthenium precursor and a reagent during an atomic layer depositionprocess.
 31. The method of claim 30, wherein the ruthenium precursor isselected from the group consisting of bis(2,4-dimethylpentadienyl)ruthenium, (2,4 -dimethylpentadienyl)ruthenium(cyclopentadienyl),(2,4-dimethylpentadienyl)ruthenium(methylcyclopentadienyl),(2,4-dimethylpentadienyl)ruthenium(ethylcyclopentadienyl),(2,4-dimethylpentadienyl) ruthenium(isopropylcyclopentadienyl),derivatives thereof, and combinations thereof.
 32. The method of claim31, wherein the reagent is selected from the group consisting ofhydrogen, atomic hydrogen, ammonia, derivatives thereof, andcombinations thereof.
 33. The method of claim 19, wherein the rutheniumlayer has a thickness within a range from about 10 Å to about 60 Å. 34.The method of claim 27, wherein the ruthenium layer has a thickness ofabout 30 Å or less.
 35. A method for forming a material on a substrate,comprising: positioning a substrate containing a dielectric materialhaving vias formed therein within a process chamber; forming a barrierlayer within the vias and on the dielectric material during a barrierdeposition process; forming a ruthenium layer on the barrier layerduring an atomic layer deposition process; and filling the vias with acopper material during an electroless chemical plating process.
 36. Amethod for forming a material on a substrate, comprising: exposing asubstrate to a pre-clean process, wherein the substrate contains adielectric layer having vias formed therein; forming a barrier layer onthe dielectric layer and within the vias during a barrier layerdeposition process; forming a ruthenium layer on the barrier layerduring an atomic layer deposition process or a physical vapor depositionprocess; and filling the vias with a copper material during anelectroless chemical plating process or an electrochemical platingprocess.